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128K x 36, 3.3V Synchronous IDT71V546 SRAM with ZBTTM Feature, TM Burst Counter and Pipelined Outputs
Features
128K x 36 memory configuration, pipelined outputs Supports high performance system speed - 133 MHz (4.2 ns Clock-to-Data Access) ZBTTM Feature - No dead cycles between write and read cycles Internally synchronized registered outputs eliminate the need to control OE Single R/W (READ/WRITE) control pin Positive clock-edge triggered address, data, and control signal registers for fully pipelined applications 4-word burst capability (interleaved or linear) Individual byte write (BW1 - BW4) control (May tie active) Three chip enables for simple depth expansion Single 3.3V power supply (5%) Packaged in a JEDEC standard 100-pin TQFP package clock cycle, and two cycles later its associated data cycle occurs, be it read or write. The IDT71V546 contains data I/O, address and control signal registers. Output enable is the only asynchronous signal and can be used to disable the outputs at any given time. A Clock Enable (CEN) pin allows operation of the IDT71V546 to be suspended as long as necessary. All synchronous inputs are ignored when CEN is high and the internal device registers will hold their previous values. There are three chip enable pins (CE1, CE2, CE2) that allow the user to deselect the device when desired. If any one of these three is not active when ADV/LD is low, no new memory operation can be initiated and any burst that was in progress is stopped. However, any pending data transfers (reads or writes) will be completed. The data bus will tri-state two cycles after the chip is deselected or a write initiated. The IDT71V546 has an on-chip burst counter. In the burst mode, the IDT71V546 can provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by the LBO input pin. The LBO pin selects between linear and interleaved burst sequence. The ADV/LD signal is used to load a new external address (ADV/LD = LOW) or increment the internal burst counter (ADV/LD = HIGH). The IDT71V546 SRAM utilizes IDT's high-performance, high-volume 3.3V CMOS process, and is packaged in a JEDEC Standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) for high board density.
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x
x
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Description
The IDT71V546 is a 3.3V high-speed 4,718,592-bit (4.5 Megabit) synchronous SRAM organized as 128K x 36 bits. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus it has been given the name ZBTTM, or Zero Bus Turn-around. Address and control signals are applied to the SRAM during one
Pin Description Summary
A0 - A16 CE1, CE2, CE2 OE R/W CEN BW1, BW2, BW3, BW4 CLK ADV/LD LBO I/O0 - I/O31, I/OP1 - I/OP4 VDD VSS Address Inputs Three Chip Enables Output Enable Read/Write Signal Clock Enable Individual Byte Write Selects Clock Advance Burst Address / Load New Address Linear / Interleaved Burst Order Data Input/Output 3.3V Power Ground Input Input Input Input Input Input Input Input Input I/O Supply Supply Synchronous Synchronous Asynchronous Synchronous Synchronous Synchronous N/A Synchronous Static Synchronous Static Static
3821 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola Inc.
DECEMBER 1999
DSC-3821/03
1
(c)1999 Integrated Device Technology, Inc.
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Pin Definitions(1)
Symbol A0 - A16 Pin Function Address Inputs I/O I Active N/A Description Synchronous Address inputs. The address register is triggered by a combination of the rising edge of CLK and ADV/LD Low, CEN Low and true chip enables. ADV/LD is a synchronous input that is used to load the internal registers with new address and control when it is sampled low at the rising edge of clock with the chip selected. When ADV/LD is low with the chip deselected, any burst in progress is terminated. When ADV/LD is sampled high then the internal burst counter is advanced for any burst that was in progress. The external addresses are ignored when ADV/LD is sampled high. R/W signal is a synchronous input that identified whether the current load cycle initiated is a Read or Write access to the memory array. The data bus activity for the current cycle takes place two clock cycles later. Synchrono us Clock Enable Input. When CEN is sampled high, all other synchronous inputs, includ ing clock are ignored and outputs remain unchanged. The effect of CEN samp led high on the device outputs is as if the low to high clock transition did not occur. For normal operation, CEN must be sampled low at rising edge of clock. Synchronous byte write enables. Enable 9-bit byte has its own active low byte write enable. On load write cycles (When R/W and ADV/LD are sampled low) the appropriate byte write signal (BW1 - BW4) must be valid. The byte write signal must also be valid on each cycle of a burst write. Byte Write signals are ignored when R/W is sampled high. The appropriate byte(s) of data are written into the device two cycles later. BW1 - BW4 can all be tied low if always doing write to the entire 36-bit word. Synchro nous active low chip enable. CE1 and CE2 are used with CE2 to enable the IDT71V546. (CE1 or CE2 sampled high or CE2 sampled low) and ADV/LD low at the rising edge of clock, initiates a deselect cycle. the ZBTTM has a two cycle deselect, i.e., the data bus will tri-state two clock cycles after deselect is initiated. Synchronout active high chip enable. CE2 is used with CE1 and CE2 to enable the chip. CE2 has inverted polarity but otherwise identical to CE1 and CE2. This is the clock input to the IDT71V546. Except for OE, all timing references for the device are made with respect to the rising edge of CLK. Synchronous data input/output (I/O) pins. Both the data input path and data output path are registered and triggered by the rising edge of CLK. Burst order selection input. When LBO is high the Interleaved burst sequence is selected. When LBO is low the Linear burst sequence is selected. LBO is a static DC input. Asynchronous output enable. OE must be low to read data from the 71V546. When OE is high the I/O pins are in a high-impedance state. OE does not need to be actively controlled for read and write cycles. In normal operation, OE can be tied low. 3.3V power supply input. Ground pin.
3821 tbl 02
ADV/LD
Address/Load
I
N/A
R/W
Read/Write
I
N/A
CEN
Clock Enable
I
LOW
BW1 - BW4
Individual Byte Write Enables
I
LOW
CE1, CE2
Chip Enables
I
LOW
CE2 CLK I/O0 - I/O31 I/OP1 - I/OP4 LBO
Chip Enable Clock Data Input/Output Linear Burst Order Output Enable
I I I/O I
HIGH N/A N/A LOW
OE
I
LOW
VDD VSS
Power Supply Ground
N/A N/A
N/A N/A
NOTE: 1. All synchronous inputs must meet specified setup and hold times with respect to CLK.
2
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Functional Block Diagram
LBO Address A [0:16] CE1, CE2, CE2 R/W CEN ADV/LD BWx
D Clk D Q Control D Q
128K x 36 BIT MEMORY ARRAY
Address
Input Register
DI
DO
Q
Control Logic
Mux
Sel
D Clk
Clock
Output Register Q
OE
Gate
3821 drw 01
.
Data I/O [0:31], I/O P[1:4]
Recommended Operating Temperature and Supply Voltage
Grade Commercial Industrial Temperature 0OC to +70OC -40OC to +85OC VSS 0V 0V VDD 3.3V5% 3.3V5%
3821 tbl 03
Recommended DC Operating Conditions
Symbol VDD VSS VIH VIH VIL Parameter Supply Voltage Ground Input High Voltage - Inputs Input High Voltage - I/O Input Low Voltage Min. 3.135 0 2.0 2.0 -0.5(1) Typ. 3.3 0
____ ____ ____
Max. 3.465 0 4.6 VDD+0.3(2) 0.8
Unit V V V V V
3821 tbl 04
NOTES: 1. VIL (min.) = -1.0V for pulse width less than tCYC/2, once per cycle. 2. VIH (max.) = +6.0V for pulse width less than tCYC/2, once per cycle.
3 6.42
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
I/OP3 I/O16 I/O17 VDD VSS I/O18 I/O19 I/O20 I/O21 VSS VDD I/O22 I/O23 VDD(1) VDD VDD VSS I/O24 I/O25 VDD VSS I/O26 I/O27 I/O28 I/O29 VSS VDD I/O30 I/O31 I/OP4
CE2 BW4 BW3 BW2 BW1 CE2 VDD VSS CLK R/W CEN OE ADV/LD NC(2) NC(2) A8 A9
A6 A7 CE1
Pin Configuration
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
80 79 78 77 76 75 74 73 72 71 70 69 68 67
PK100-1
66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
I/OP2 I/O15 I/O14 VDD VSS I/O13 I/O12 I/O11 I/O10 VSS VDD I/O9 I/O8 VSS VDD VDD VSS I/O7 I/O6 VDD VSS I/O5 I/O4 I/O3 I/O2 VSS VDD I/O1 I/O0 I/OP1
.
.
LBO A5 A4 A3 A2 A1 A0 NC NC
VSS VDD NC NC
Top View TQFP
NOTES: 1. Pin 14 does not have to be connected directly to VDD as long as the input voltage is > VIH. 2. Pins 83 and 84 are reserved for future A17 (8M) and A18 (16M) respectively.
Absolute Maximum Ratings(1)
Symbol VTERM(2) VTERM TA TBIAS TSTG PT IOUT
(3)
Capacitance
Unit V V
o
Rating Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Operating Temperature Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
Value -0.5 to +4.6 -0.5 to VDD+0.5 0 to +70 -55 to +125 -55 to +125 2.0 50
(TA = +25C, f = 1.0MHz, TQFP package)
Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. 5 7 Unit pF pF
3821 tbl 06
C C C
o
NOTE: 1. This parameter is guaranteed by device characterization, but not production tested.
o
W mA
3821 tbl 05
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VDD and Input terminals only. 3. I/O terminals.
4
A10 A11 A12 A13 A14 A15 A16
3821 drw 02
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Synchronous Truth Table(1)
CEN L L L L L L H R/W L H X X X X X Chip(5) Enable Select Select X X Deselect X X ADV/LD L L H H L H X BWx Valid X Valid X X X X ADDRESS USED External External Internal Internal X X X PREVIOUIS CYCLE X X LOAD WRITE/ BURST WRITE LOAD READ/ BURST READ X DESELECT / NOOP X CURRENT CYCLE LOAD WRITE LOAD READ BURST WRITE (Advance Burst Counter)(2) BURST READ (Advance Burst Counter)(2) DESELECT or STOP(3) NOOP SUSPEND
(4)
I/O (2 cycles later) D(7) Q(7) D(7) Q(7) HiZ HiZ Previous Value
3821 tbl 07
NOTES: 1. L = VIL, H = VIH, X = Don't Care. 2. When ADV/LD signal is sampled high, the internal burst counter is incremented. The R/W signal is ignored when the counter is advanced. Therefore the nature of the burst cycle (Read or Write) is determined by the status of the R/W signal when the first address is loaded at the beginning of the burst cycle. 3. Deselect cycle is initiated when either (CE1, or CE2 is sampled high or CE2 is sampled low) and ADV/LD is sampled low at rising edge of clock. The data bus will tri-state two cycles after deselect is initiated. 4. When CEN is sampled high at the rising edge of clock, that clock edge is blocked from propogating through the part. The state of all the internal registers and the I/ Os remains unchanged. 5. To select the chip requires CE1 = L, CE2 = L, CE2 = H on these chip enables. Chip is deselected if either one of the chip enables is false. 6. Device Outputs are ensured to be in High-Z after the first rising edge of clock upon power-up. 7. Q - Data read from the device, D - data written to the device.
Partial Truth Table for Writes(1)
Operation READ WRITE ALL BYTES WRITE BYTE 1 (I/O [0:7], I/OP1)
(2)
R/W H L L L L L L
BW1 X L L H H H H
BW2 X L H L H H H
BW3 X L H H L H H
BW4 X L H H H L H
3821 tbl 08
WRITE BYTE 2 (I/O [8:15], I/OP2)(2) WRITE BYTE 3 (I/O [16:23], I/OP3)(2) WRITE BYTE 4 (I/O [24:31], I/OP4) NO WRITE
NOTES:
(2)
1. L = VIL, H = VIH, X = Don't Care.
2. Multiple bytes may be selected during the same cycle.
5 6.42
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Interleaved Burst Sequence Table (LBO=VDD)
Sequence 1 A1 First Address Second Address Third Address Fourth Address
(1)
Sequence 2 A1 0 0 1 1 A0 1 0 1 0
Sequence 3 A1 1 1 0 0 A0 0 1 0 1
Sequence 4 A1 1 1 0 0 A0 1 0 1 0
3821 tbl 09
A0 0 1 0 1
0 0 1 1
NOTE: 1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting.
Linear Burst Sequence Table (LBO=VSS)
Sequence 1 A1 First Address Second Address Third Address Fourth Address
(1)
Sequence 2 A1 0 1 1 0 A0 1 0 1 0
Sequence 3 A1 1 1 0 0 A0 0 1 0 1
Sequence 4 A1 1 0 0 1 A0 1 0 1 0
3821 tbl 10
A0 0 1 0 1
0 0 1 1
NOTE: 1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting.
Functional Timing Diagram(1)
CYCLE CLOCK ADDRESS (A0 - A16)
(2)
n+29
n+30
n+31
n+32
n+33
n+34
n+35
n+36
n+37
A29
A30
A31
A32
A33
A34
A35
A36
A37 A37
CONTROL (R/W, ADV/LD, BWx)
(2)
(2)
C29
C30
C31
C32
C33
C34
C35
C36
C37 C37
DATA I/O [0:31], I/O P[1:4]
D/Q27
D/Q28
D/Q29
D/Q30
D/Q31
D/Q32
D/Q33
D/Q34
D/Q35
,
NOTE: 3821 drw 03 1. This assumes CEN, CE1, CE2, CE2 are all true. 2. All Address, Control and Data_In are only required to meet set-up and hold time with respect to the rising edge of clock. Data_Out is valid after a clock-to-data delay from the rising edge of clock.
6
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Device Operation - Showing Mixed Load, Burst, Deselect and NOOP Cycles(2)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 n+10 n+11 n+12 n+13 n+14 n+15 n+16 n+17 n+18 n+19 Address A0 X A1 X X A2 X X A3 X A4 X X A5 A6 A7 X A8 X A9 R/W H X H X X H X X L X L X X L H L X H X L ADV/LD L H L L H L H L L H L L H L L L H L H L CE(1) L X L H X L X H L X L H X L L L X L X L CEN L L L L L L L L L L L L L L L L L L L L BWx X X X X X X X X L L L X X L X L L X X L OE X X L L L X X L L X X X X X X X L X X L I/O X X Q0 Q0+1 Q1 Z Z Q2 Q2+1 Z D3 D3+1 D4 Z Z D5 Q6 D7 D7+1 Q8 Load read Burst read Load read Deselect or STOP NOOP Load read Burst read Deselect or STOP Load write Burst write Load write Deselect or STOP NOOP Load write Load read Load write Burst write Load read Burst read Load write
3821 tbl 11
Comments
NOTES: 1. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 2. H = High; L = Low; X = Don't Care; Z = High Impedance.
7 6.42
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Read Operation(1)
Cycle n n+1 n+2 Address A0 X X R/W H X X ADV/LD L X X CE(2) L X X CEN L L X BWx X X X OE X X L I/O X X Q0 Comments Address and Control meet setup Clock Setup Valid Co ntents of Address A0 Read Out
3821 tbl 12
NOTE: 1. H = High; L = Low; X = Don't Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
Burst Read Operation(1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 Address A0 X X X X A1 X X A2 R/W H X X X X H X X H ADV/LD L H H H H L H H L CE(2) L X X X X L X X L CEN L L L L L L L L L BWx X X X X X X X X X OE X X L L L L L L L I/O X X Q0 Q0+1 Q0+2 Q0+3 Q0 Q1 Q1+1 Comments Address and Control meet setup Clock Setup Valid, Advance Counter Address A0 Read Out, Inc. Count Address A0+1 Read Out, Inc. Count Address A0+2 Read Out, Inc. Count Address A0+3 Read Out, Load A1 Address A0 Read Out, Inc. Count Address A1 Read Out, Inc. Count Address A1+1 Read Out, Load A2
3821 tbl 13
NOTE: 1. H = High; L = Low; X = Don't Care; Z = High Impedance.. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
8
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Write Operation(1)
Cycle n n+1 n+2 Address A0 X X R/W L X X ADV/LD L X X CE(2) L X X CEN L L L BWx L X X OE X X X I/O X X D0 Comments Address and Control meet setup Clock Setup Valid Write to Address A0
3821 tbl 14
NOTE: 1. H = High; L = Low; X = Don't Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
Burst Write Operation(1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 Address A0 X X X X A1 X X A2 R/W L X X X X L X X L ADV/LD L H H H H L H H L CE(2) L X X X X L X X L CEN L L L L L L L L L BWx L L L L L L L L L OE X X X X X X X X X I/O X X D0 D0+1 D0+2 D0+3 D0 D1 D1+1 Comments Address and Control meet setup Clock Setup Valid, Inc. Count Address A0 Write, Inc. Count Address A0+1 Write, Inc. Count Address A0+2 Write, Inc. Count Address A0+3 Write, Load A1 Address A0 Write, Inc. Count Address A1 Write, Inc. Count Address A1+1 Write, Load A2
3821 tbl 15
NOTE: 1. H = High; L = Low; X = Don't Care; ? = Don't Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
9 6.42
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Read Operation With Clock Enable Used(1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 Address A0 X A1 X X A2 A3 A4 R/W H X H X X H H H ADV/LD L X L X X L L L CE(2) L X L X X L L L CEN L H L H H L L L BWx X X X X X X X X OE X X X L L L L L I/O X X X Q0 Q0 Q0 Q1 Q2 Comments Address and Control meet setup Clock n+1 Ignored Clock Valid Clock Ignored. Data Q0 is on the bus Clock Ignored. Data Q0 is on the bus Address A0 Read out (but trans.) Ad dress A1 Read out (bus trans.) Ad dress A2 Read out (bus trans.)
3821 tbl 16
NOTE: 1. H = High; L = Low; X = Don't Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
Write Operation with Clock Enable Used(1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 Address A0 X A1 X X A2 A3 A4 R/W L X L X X L L L ADV/LD L X L X X L L L CE(2) L X L X X L L L CEN L H L H H L L L BWx L X L X X L L L OE X X X X X X X X I/O X X X X X D0 D1 D2 Comments Address and Control meet setup Clock n+1 Ignored Clock Valid Clock Ignored Clock Ignored Write data D0 Write data D1 Write data D2
3821 tbl 17
NOTE: 1. H = High; L = Low; X = Don't Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
10
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Read Operation With Chip Enable Used(1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 Address X X A0 X A1 X X A2 X X R/W X X H X H X X H X X ADV/LD L L L L L L L L L L CE(1) H H L H L H H L H H CEN L L L L L L L L L L BWx X X X X X X X X X X OE X X X X L X L X X L I/O ? ? Z Z Q0 Z Q1 Z Z Q2 Deselected Deselected Address and Control meet setup Deselected or STOP Address A0 read out. Load A1 Deselected or STOP Address A1 Read out. Deselected Address and Control meet setup Deselected or STOP Address A2 read out. Deselected
3821 tbl 18
Comments
NOTES: 1. H = High; L = Low; X = Don't Care; ? = Don't Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 3. Device Outputs are ensured to be in High-Z after the first rising edge of clock upon power-up.
Write Operation With Chip Enable Used(1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 Address X X A0 X A1 X X A2 X X R/W X X L X L X X L X X ADV/LD L L L L L L L L L L CE(1) H H L H L H H L H H CEN L L L L L L L L L L BWx X X L X L X X L X X OE X X X X X X X X X X I/O ? ? Z Z D0 Z D1 Z Z D2 Deselected Deselected Address and Control meet setup Deselected or STOP Address D0 Write In. Load A1 Deselected or STOP Address D1 Write In. Deselected Address and Control meet setup Deselected or STOP Address D2 Write In. Deselected
3821 tbl 19
Comments
NOTES: 1. H = High; L = Low; X = Don't Care; ? = Don't Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
11 6.42
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V +/-5%)
Symbol |ILI| |ILI| |ILO| VOL VOH Parameter Input Leakage Current LBO Input Leakage Current(1) Output Leakage Current Output Low Voltage Output High Voltage Test Conditions VDD = Max., VIN = 0V to VDD VDD = Max., VIN = 0V to VDD CE > VIH or OE > VIH, VOUT = 0V toVDD, VDD = Max. IOL = 5mA, VDD = Min. IOH = -5mA, VDD = Min. Min.
___
Max. 5 30 5 0.4
___
Unit A A A V V
3821 tbl 20
___
___ ___
2.4
NOTE: 1. The LBO pin will be internally pulled to VDD if it is not actively driven in the application.
DC Electrical Characteristics Over the Opearting Temperature and Supply Voltage Range(1) (VDD = 3.3V +/-5%, VHD = VDD0.2V, VLD = 0.2V)
S133 Symbol IDD ISB1 ISB2 ISB3 Parameter Operating Power Supply Current CMOS Standby Power Supply Current Clock Running Power Supply Current Idle Power Supply Current Test Conditions Device Selected, Outputs Open, ADV/LD = X, VDD = Max., VIN > VIH or < VIL, f = fMAX(2) Device Deselected, Outputs Open, VDD = Max., VIN > VHD or < VLD, f = 0(2) Device Deselected, Outputs Open, VDD = Max., VIN > VHD or < VLD, f = fMAX(2) Device Selected, Outputs Open, CEN > VIH VDD = Max., VIN > VHD or < VLD, f = fMAX(2) Com'l 300 40 110 40 Ind 310 45 120 45 S117 Com'l 275 40 105 40 Ind 285 45 115 45 S100 Com'l 250 40 100 40 Ind 260 45 110 45 Unit mA mA mA mA
3821 tbl 21
NOTES: 1. All values are maximum guaranteed values. 2. At f = fMAX, inputs are cycling at the maximum frequency of read cycles of 1/tCYC; f=0 means no input lines are changing.
AC Test Loads
+1.5V 50
AC Test Conditions
Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Timing Reference Levels AC Test Load 0 to 3V 2ns 1.5V 1.5V See Figures 1
3821 tbl 22
I/O
Z0 = 50
3821 drw 04
Figure 1. AC Test Load
,
6 5 4 tCD 3 (Typical, ns) 2 1 20 30 50 80 100 Capacitance (pF) 200
3821 drw 05
Figure 2. Lumped Capacitive Load, Typical Derating
,
12
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(VDD = 3.3V +/-5%, Commercial and Industrial Temperature Ranges)
71V546S133 Symbol Clock Parameters tCYC tF
(1) (2)
71V546S117 Min. Max.
71V546S100 Min. Max. Unit
Parameter
Min.
Max.
Clock Cycle Time Clock Frequency Clock High Pulse Width Clock Low Pulse Width
7.5
____
____
8.5
____
____
10
____
____
ns MHz ns ns
133
____
117
____
100
____
tCH tCL
2.5 2.5
3 3
3.5 3.6
(2)
____
____
____
Output Parameters tCD tCDC tCLZ
(3,4,5) (3,4,5)
Clock High to Valid Data Clock High to Data Change Clock High to Output Active Clock High to Data High-Z Output Enable Access Time
(3,4) (3.4)
____
4.2
____ ____
____
4.5
____ ____
____
5
____ ____
ns ns ns ns ns ns ns
1.5 1.5 1.5
____
1.5 1.5 1.5
____
1.5 1.5 1.5
____
tCHZ tOE tOLZ
3.5 4.2
____
3.5 4.5
____
3.5 5
____
Output Enable Low to Data Active Output Enable High to Data High-Z
0
____
0
____
0
____
tOHZ
3.5
3.5
3.5
Setup Times tSE tSA tSD tSW tSADV tSC tSB Hold Times tHE tHA tHD tHW tHADV tHC tHB Clock Enable Hold Time Address Hold Time Data in Hold Time Read/Write (R/W) Hold Time Advance/Load (ADV/LD) Hold Time Chip Enable/Select Hold Time Byte Write Enable (BWx) Hold Time 0.5 0.5 0.5 0.5 0.5 0.5 0.5
____ ____
Clock Enable Setup Time Address Setup Time Data in Setup Time Read/Write (R/W) Setup Time Advance/Load (ADV/LD) Setup Time Chip Enable/Select Setup Time Byte Write Enable (BWx) Setup Time
2.0 2.0 1.7 2.0 2.0 2.0 2.0
____ ____
2.0 2.0 1.7 2.0 2.0 2.0 2.0
____ ____
2.2 2.2 2.0 2.2 2.2 2.2 2.2
____ ____
ns ns ns ns ns ns ns
____ ____ ____
____ ____ ____
____ ____ ____
____ ____
____ ____
____ ____
0.5 0.5 0.5 0.5 0.5 0.5 0.5
____ ____
0.5 0.5 0.5 0.5 0.5 0.5 0.5
____ ____
ns ns ns ns ns ns ns
3821 tbl 23
____ ____ ____
____ ____ ____
____ ____ ____
____ ____
____ ____
____ ____
NOTES: 1. tF = 1/tCYC. 2. Measured as HIGH above 2.0V and LOW below 0.8V. 3. Transition is measured 200mV from steady-state. 4. These parameters are guaranteed with the AC load (Figure 1) by device characterization. They are not production tested. 5. To avoid bus contention, the output buffers are designed such that tCHZ (device turn-off) is about 2 ns faster than tCLZ (device turn-on) at a given temperature and voltage. The specs as shown do not imply bus contention because tCLZ is a Min. parameter that is worse case at totally different test conditions (0 deg. C, 3.465V) than tCHZ, which is a Max. parameter (worse case at 70 deg. C, 3.135V).
13 6.42
tCYC
CLK
tSE tHE tCH tCL
CEN
tHADV
tSADV
ADV/LD
tSW tHW
R/W
tSA tHA
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
ADDRESS
tSC tHC
A1 A2
Timing Waveform of Read Cycle(1,2,3,4)
CE1,CE2(2)
14
tCDC tCD Q(A2+1) (CEN high, eliminates current L-H clock edge) Q(A2+2) tCLZ tCD tCDC (Burst Wraps around to initial state) Q(A2+2) Q(A2+3) tCHZ
BW1,BW4
OE
DATA Out O1(A1) Pipeline Read Pipeline Read
O1(A2)
O1(A2) Burst Pipeline Read
3821 drw 06
Commercial and Industrial Temperature Ranges
NOTES: 1. Q (A1) represents the first output from the external address A1. Q (A2) represents the first output from the external address A2; Q (A2+1) represents the next output data in the burst sequence of the base address A2, etc. where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW. 4. R/W is don't care when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the R/W signal when new address and control are loaded into the SRAM.
tCYC
CLK
tSE tHE tCH tCL
CEN
tHADV
tSADV
ADV/LD
tSW tHW
R/W
tSA tHA
ADDRESS
tSC tHC
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
A1
A2
CE1,CE2 (2)
tSB tHB
Timing Waveform of Write Cycles(1,2,3,4,5)
15 6.42
tSD tHD D(A2) D(A1) D (A2+1) Pipeline Write Pipeline Write
BW1,BW4
OE
(CEN high, eliminates current L-H clock edge) tSD tHD D (A2+2) (Burst Wraps around to initial state) D (A2+3) D(A2)
DATA In
Burst Pipeline Write 3821 drw 07
Commercial and Industrial Temperature Ranges
NOTES: 1. D (A1) represents the first input to the external address A1. D (A2) represents the first input to the external address A2; D (A2+1) represents the next input data in the burst sequence of the base address A2, etc. where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW. 4. R/W is don't care when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the R/W signal when new address and control are loaded into the SRAM. 5. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM.
.
tCYC
CLK
tSE tHE tCH tCL
CEN
tHADV
tSADV
ADV/LD
tSW tHW
R/W
tSA tHA
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
ADDRESS A3 A6
tSC tHC
A1
A2 A4 A5
A7
A8
A9
CE1, CE2
tSB tHB
(2)
Timing Waveform of Combined Read and Write Cycles(1,2,3)
16
tSD tHD D(A2)
BW1 - BW4
OE
DATA In Write
tCHZ tCD
D(A4)
D(A5)
Write
tCLZ tCDC
DATA Out Q(A1) Read
Q(A3) Read Read
Q(A6)
Q(A7)
Commercial and Industrial Temperature Ranges
3821 drw 08
NOTES: 1. Q (A1) represents the first output from the external address A1. D (A2) represents the input data to the SRAM corresponding to address A2. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM.
tCYC
CLK
tSE tHE tCH tCL
CEN
tSADV tHADV
ADV/LD
tSW tHW
R/W
tSA tHA
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
ADDRESS A3
tSC tHC
A1
A2
A4
A5
CE1, CE2 (2)
tSB tHB B(A2)
Timing Waveform of CEN Operation(1,2,3,4)
17 6.42
tCHZ tCDC tCD
BW1 - BW4
OE
tSD tHD D(A2)
DATA In
DATA Out
tCLZ
Q(A1)
Q(A1)
Q(A3)
3821 drw 09
Commercial and Industrial Temperature Ranges
NOTES: 1. Q (A1) represents the first output from the external address A1. D (A2) represents the input data to the SRAM corresponding to address A2. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH.. 3. CEN when sampled high on the rising edge of clock will block that L-H transition of the clock from propogating into the SRAM. The part will behave as if the L-H clock transition did not occur. All internal registers in the SRAM will retain their previous state. 4. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM.
.
tCYC
CLK
tSE tHE tCH tCL
CEN
tHADV
tSADV
ADV/LD
tSW tHW
R/W
tSA tHA
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
ADDRESS A3
tSC tHC
A1
A2 A4
A5
CE1,CE2 (2)
tSB tHB
Timing Waveform of CS Operation(1,2,3,4)
18
D(A3) tCHZ tCD tCLZ tCDC
BW1 - BW4
OE
tSD tHD
DATA In
DATA Out Q(A1)
Q(A2)
Q(A3)
3821 drw 10
Commercial and Industrial Temperature Ranges
NOTES: 1. Q (A1) represents the first output from the external address A1. D (A3) represents the input data to the SRAM corresponding to address A3 etc. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. When either one of the Chip enables (CE1, CE2, CE2) is sampled inactive at the rising clock edge, a deselect cycle is initiated. The data-bus tri-states two cycles after the initiation of the deselect cycle. This allows for any pending data transfers (reads or writes) to be completed. 4. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM.
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Timing Waveform of OE Operation(1)
OE
tOE tOHZ tOLZ
DATA Out
NOTE: 1. A read operation is assumed to be in progress.
Valid
3821 drw 11
Ordering Information
IDT 71V546 Device Type S Power XX Speed PF Package X Process/ Temperature Range
Blank I
Commercial (0C to +70C) Industrial (-40C to +85C)
PF
Plastic Thin Quad Flatpack, 100 pin (PK100-1)
133 117 100
Clock Frequency in Megahertz
PART NUMBER
71V546S133PF 71V546S117PF 71V546S100PF
tCD PARAMETER SPEED IN MEGAHERTZ
4.2 ns 4.5 ns 5 ns 133 MHz 117 MHz 100 MHz
CLOCK CYCLE TIME
7.5 ns 8.5 ns 10 ns
3821 drw 12
19 6.42
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with ZBTTM Feature, Burst Counter and Pipelined Outputs TM
Commercial and Industrial Temperature Ranges
Datasheet Document History
6/15/99 9/13/99 12/31/99 Pg. 12 Pg. 20 Pp. 3, 12, 13, 19 Updated to new format Corrected ISB3 conditions Added Datasheet Document History Added Industrial Temperature range offerings
CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054
for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com
for Tech Support: sramhelp@idt.com 800-544-7726, x4033
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
20

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